Sealing method for wiped joints



Patented May 23, 1950 ammonites-222g; wiser)" mines v 'n's itong Maa isen", and Gearee" s;

mis

assignors to Bell Tele- Ne ii'i'hWih'gji-Q'Afililicatidfi January 7'', 194%; serial- No. 720mm "soldiers".

This inventiortrela'tes tda inethoti efiseeiin j hints betwe'enhollo'w members. I

An object of the invention ls tii" preyide; 9; method" for insuring that wiped, bra'zeii'o'r' welded joints between hollow or tubular members, and l perticularlywiped cablesheath joints, are free fiom' porosity. The preseiitiriventiori' provides '-.-method which is particularly effective'forseeiin'g wiped joints formedbe'tween branch joints of liirge cable's. a

"oner the mam problems inusin wiping solders for joining lh'do'r other" c'eible sheaths is that porosity tends'tb def/e161) durin'g'thef Solidi fioetio'n of the soider; This" oresit'y spelieves teo'c'c'ur because while'the' wipihgsolder iseoop ing from the liquid state, the highest melting constituent solidifies out first end i'eihai'r'is fixes iii "its osition in the" joint, Whil''th'e 'rema'iriifi liquid continues to contract and to 6mm by gravity, leaving porous 'secti'onsi'n the joint; This formation of porosity'in wipe'd jbiiit'sis especially evident in joints formed between large branched celbles'; for here the-mass ofthe heated joint is so great that cooling is retarded, providing an opportunity for the" molten solder therein and form porous sections. 7

The formation of' pores "or speriing's in the eeme-sheatnjoint is, of course, detrimentel' to the-operation and life of the ciible; since in pres "sure filled. cables; the gas 'Uiid r pressure Within thecable will 1eak outg andfsih'ce' moistureffm thesurrounding'atmospliere tends toe epin and -'impair the insulatiohoii the"cbhdu s.

According to the method of the present ihvention; is wiped cable joi'rifiisifenderd ges-tigrit'by 'a'p'ply'ih'g' to'the surface of the wipiiig solde'i'f iiftei' 'it' h a's" solidified but not-cooled temple-thy; psi-- tion of a low melting alloy, which is melted by-the residum heat of the wiping-sewer $6 thfitit'r'uns over-the sur race': of the-sbldeld joint; filling 111') all possibie' orousspace's sneerscksz 'sblifii fi ing, the 16Wmeltirig alloy'"SLISthfilS of he wiped-joint forming e hel h'ietie seal- 'a'fila' 'rhd'fmelt vacuum tight;

Prior to "this invest ipii; 'irl forming bre'rieh Joints-between lallg' {75.5165} ei' ilitiifely hl'g'hpf- '-ifltige'bf-the' jbifitsifbrlfied f-tf'th it? ih'g procedure showed 3 an undesiizthl porosity, requiring a lebo OlilS freedom: 1mm: porosity" was -rib s6 that a iurtherrewipin p 'r'et1uirefl. -:By 'theirinethod oi tfi Ia; non-porous: gems they-"be o ts-mes after the firstwipin'g';

:theeuteetie 51-peh'c'e t bismuth} 41-- perceneepu' plas er minus 1-pei"- cent for eaiel 1 ma meitmg ate srt 'I'h'e prpemens er The present method is simple andrelililresrno compllcatedtechniqfie on the part of the operstar. It has been found to be eminently'suc cessful under an conditions under which it is necessary to apply a. wipe to cable'ioints infield operation. The present method opens up an entirely new new for economies and superior results in the wiping of joints; because, while previously the lack of susceptibility to porosity was the main criterionfor choosing a wiping solder, now this factor becomes less important andwipingsolders may be chosen which are cheaper or in which other valuable properties have not been sacrificed for the sake of superior resistance to porosity. The present method is capable of consistently 's'eelin'g'wiped joints even when formed of solders Which'e'repooffrom the standpoint of porosity development.

*se thaswhen it seemed to thesur'fa'ceo'f the Wiping compounds stroiigjbohd will result;

"Su'halloys may include 2111' alloy ofbismuth, lead, and tin in the proportions of from 35 per pe cent lease-and 10.0 per eeht'to18.5;per cht estrus-635 per ceht tin, halving'a, melting rengefrerii 95 (lto spent 130" C. Oihig AIS'O the elltebtie mixture ma blle'd compristhe advantsge bf s low end-sharpm'elting'peiiit.

The i alloy mayalso be iise'dcom rising 37 per cent-bismuth; 38 'per cent lead, and 2-5'p'e'r" ti -mwith 'a va'riation of about 1 per cent is each ingredient andmelting'at from 95C.to'abdut -1 25 C; Since-it contaifis iess bismutlnthis aiid'y and 8 per cent cadn i uni; with van this alloy may be varied to include compositions ranging from 39 per cent to 63 per cent bismuth, 31 per cent to 51 per cent lead, and 6 per cent to 10 per cent cadmium. Compositions of these proportions melt at from about 91.5 C. to about 115 C.

Another suitable alloy may comprise 50 per cent bismuth, 27 per cent lead, 13 per cent tin,

. members which have been joined together by and 10 per cent cadmium with variations of from, a

ing point of this alloy ranges from 70 C. to about Still another alloy suitable for use as a sealin I I compound may comprise the eutectic 55' per cent bismuth and 45 per cent lead, which melts at 125 C. The proportions of each of the ingredients may be varied by about plus or minus 2 per cent. If a non-eutectic mixture of these elements is used, the alloy may melt from 125 C. to

about 135 C. v

The wiping solder used forwiping the joints prior to the application of the above-described sealing alloys may comprise most of the solders commonly used for this purpose. Some of these solder compositions are listed below:

a. 32 per cent tin, 2 per cent antimony, 0.1 per cent arsenic, and the remainder lead (melting .from about 183 C. to about 247 C.)

b. 38 per cent tin, 0.3 per cent antimony, and the remainder lead (melting from about 183 C. to about 240 c.) I

c. 23 per cent tin, 9 per cent'cadmium, and the remainder lead (melting from about 145 C. to about 235 C.)

be sufficiently above the melting point of the sealing alloy, so that ample time is available between the point of complete solidification of the wiping solder and the melting point of the sealing alloy, to permit time for efiective application of the sealing alloy.

In'practicing the method of the present invention, the joint is wiped with the wiping solder in the usual manner. The solder is allowed to solidify completely, but before it has had time to cool down more than a few degrees below the melting point, a strip of the sealing alloy is held'against the surface of the wiping solder. 'Since the melting point of the sealing alloy is below that of the wiping solder, the residual heat containedin the wiping solder is sufficient to melt the sealing alloy,

so that it will liquefy and flow over the surface of the wiping solder, filling up the various porous spaces and cracks which may be present in the sealing solder. If desired, a small wiping cloth may be used to wipe the melted alloy around the jointuntil it covers all parts. It is not necessary to apply heat from an outside source to melt the sealing alloy since the residual heat contained in the wiping solder in sufilcient.

This method of forming gas-tight jointsbetween tubular members may also be applied to brazing or welding. For example, the low melting alloy may be applied to the welded or brazed joint after it has solidified but while it is still hot, so that the residual heat of the joint will melt the alloy causing it to run over the surface of the joint and fill up the pores and cracks which may be present.

The low melting sealing solders may also be used to eliminate porosity in wiped, brazed or welded'joints already in service. In this application the joints must be thoroughly cleansed and heated to a temperature below the melting point of themetal forming the joint, after which the sealing solder is applied in the manner previously described. The joint may be heated by means of a'torch or by pouring a hot reducing liquid such as paraffin on the joint.

I The following examples may be taken as illustrations of the present invention. Example 1.A branched joint in a lead sheathed cable, of which the outer diameter of the covering sleeve was about six inches and the outer diameters of the two smaller branches were each about two and one-half inches in diameter, was wiped with an alloy comprising 32 per cent tin, 2 per cent antimony, 0.1 per cent arsenic, and the remainder, lead, having a melting range of from 183 C. to about 247 C. The wiping alloy was allowed to solidify completely. Shortly after the alloy had solidified completely, that is when the temperature was about 180 6., about one and one-half ounces of a solid piece of a sealing alloy was held in contact with the hot wiped joint. The sealing alloy comprised 52.5 per cent bismuth, 32 per cent lead, and 15.5 per cent tin, and melted at 95 G. Since the melting point of the sealing compound was considerably lower than the temperature of the solidified wiping solder, the sealing compound melted relatively easily and ran over the surface of the wiped joint. A small wiping cloth was used to wipe the molten alloy around the joint. When the sealing compound solidified, a compact hermetically sealed joint was produced. 7

Example 2.A joint in a lead-sheathed cable was wiped with an alloy comprising 23 per cent tin, 9 per cent cadmium, and the remainder lead, melting at from 145 C. to 235 C. After the Wining solder had solidified completely, but while it was still hot, aportionof an alloy comprising 50 per cent bismuth, 27 per cent lead, 13 per cent tin, and 10 per cent cadmium melting at from 70 C. to 75 C. was held in contact with the hot wiped joint. The sealingalloy melted and drained around the joint. After the sealing compound had solidified the joint was found to be vacuumtight. 1 Example 3.A joint in a lead-sheathed cable was wiped with a wiping solder comprising 38 per cent tin, 0.3 per cent antimony, and theremainder lead, melting at from 183 C. to 240 C. When the wiping-solder had solidified completely, butwhile it was still hot, a solidpiece of alloy comprising per cent bismuth and 45 per cent sible pores and openings present in the solidified wiping solder; When the sealing solder had solidified, a hermetically sealed joint-resulted.

The sealing method of the present-invention can, of' course, be used to formhermetic seals on cable sheaths made ofother metals than lead, and also on devices wherein a joint between two hollow articles is formed, such as various forms of piping, particularly lead piping.

It is also to be understood that various changes may be made in the steps of the method, and that known chemical equivalents may be employed and that changes may be resorted to in the proportions of the ingredients, without departing from the spirit of the inventioi What is claimed is:

1. The method of forming uniformly gas-tight wiped joints in tubular members comprising wiping the joint with a non-eutectic wiping solder, allowing the solder to solidify but not cool substantially more than necessary for solidification, contacting a solid piece of an alloy which has a melting point below that of the wiping solder and which is capable of forming an alloy with said wiping solder with the wiped joint before the surface of wiped joint has cooled below the melting point of said low melting alloy, maintaining said contact until said alloy has melted and wiping the outer surface of the wiped joint with said molten alloy, said molten alloy forming an alloy with the surfaces of said wiping solder with which it comes into contact.

2. A method of forming a gas-tight joint between tubular members comprising wiping the joint with a non-eutectic wiping solder, cooling said solder to the point of solidification, contacting a portion of an alloy which has a melting point lower than the melting point of said wiping solder and which is capable of alloying with said wiping solder, with the wiped joint before the surface of the wiped joint has cooled below the melting point of said low melting alloy, maintaining said low melting alloy in contact with the wiped joint until said alloy is melted by the residual heat remaining in the wiped solder, whereby said alloy liquefies and flows over the surface of said wiped solder to fill up the porous spaces in said wiped solder and form an alloy with the surface of the wiped solder with which it comes into contact.

3. The method of claim 2 in which the wiping solder comprises about 32 per cent tin, about 2 per cent antimony, about 0.1 per cent arsenic, and the remainder essentially lead, and the low melting alloy comprises bismuth, lead and tin.

4. The method of claim 2 in which the low melting alloy comprises 39 per cent to 63 per cent bismuth, 31 per cent to 51 per cent lead, and 6 per cent to 10 per cent cadmium, substantially no other ingredients being present except incidental impurities.

5. The method of claim 2 in which said low melting alloy comprises about 32 per cent lead, 52.5 per cent bismuth, and 15.5 per cent tin, with a variation in each ingredient of about plus or minus 1 per cent, and substantially no other ingredients present except impurities.

6. The method of forming uniformly sound wiped joints in tubular members comprising wiping the joint with a, non-eutectic wiping solder, cooling the solder to its freezing point but not substantially below, contacting a solid piece of an alloy having a melting point below that of the wiping solder and being capable of alloying with said solder with the wiped joint before the surface of the wiped joint has cooled below the melting point of said low melting alloy, and causing said alloy to melt and run into any porous spaces which may be present in the wiped solder, said low melting alloy comprising from 35 per cent to per cent bismuth, 22 per cent to 37 per cent lead, and 10 per cent to 35 per cent tin, substantially no other ingredients being present, except impurities, said low melting alloy forming an alloy with said wiped solder.

7. The method of forming a sealed joint between tubular members employing a non-eutectic wiping solder containing iead as its principal ingredient, and an alloy having a melting point considerably lower than the melting point of said solder and being capable of alloying with said solder, said method comprising wipin said joint with said wiping solder, cooling the wiped solder to the point of solidification, contacting a portion of said alloy with said wiped solder while the surface of said wiped solder is at a temperature substantially above the melting point of said alloy, maintaining said alloy portion in contact with said wiper solder until said alloy portion is melted by the residual heat remaining in the wiper solder, and wiping the liquefied alloy into the pores in the wiped solder joint to form an alloy with the surfaces of the wiped solder with which it comes into contact.

8. The method of forming gas-tight joints in tubular members comprising using molten metal to form a joint between said tubular members, cooling said joint to the freezing point of said molten metal, applying to the surface of said joint a solid piece of an alloy which has a melting point lower than the melting point of said jointforming metal and which is capable of alloying with said joint-forming metal, the temperature of the metal of the joint at the time of application of said alloy lying between the freezing point of said metal forming the joint and the melting point of said alloy, and melting said alloy by means of the residual heat contained in the metal of said joint directing the molten alloy by capillary action into the fine channels present in the metal of the joint, whereby said alloy forms an alloy with the surface of the metal of the joint with which it comes into contact.

GEORGE M. BOUTON. GEORGE S. PHIPPS.

REFERENCES CK'EZED The following references are of record in the file of this patent:

UNITED STATES PATENTS Number Name Date 369,121 Patterson Aug. 30, 1887 803,920 Moifett Nov. 7, 1905 993,195 Phelps May 23, 1911 1,920,791 Hogan Aug. 1, 1933 2,236,862 Williams Apr. 1, 1941 2,247,559 Phipps July 1, 1941 2,287,227 Bowsher June 23, 1942 2,348,358 Phillips May 9, 1944 2,370,439 Beard Feb. 27, 1945 OTHER REFERENCES Steel, Mag. Tin-Free and Low-Tin solders, Feb. 26, 1945, pp. 86, 87, 88, 90, 92, 132, 134 and 136. 

